BCR 108S H6327

BCR108... NPN Silicon Digital Transistor • Switching circuit, inverter, interface circuit, driver circuit • Built in bias resistor (R1=2.2 kΩ, R2=47 kΩ) • BCR108S: Two internally isolated transistors with good matching in one multichip package • BCR108S: For orientation in reel see package information below • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BCR108/F BCR108T/W BCR108S C C1 B2 3 6 5 E2 4 R2 R1 R1 TR2 TR1 R2 R1 R2 1 B 2 1 2 3 E E1 B1 C2 EHA07184 EHA07174 Type Marking BCR108 WHs 1=B 2=E 3=C - - - SOT23 BCR108F WHs 1=B 2=E 3=C - - - TSFP-3 BCR108S WHs 1=E1 2=B1 3=C2 4=E2 5=B2 6=C1 SOT363 BCR108W WHs 1=B 1Pb-containing Pin Configuration 2=E 3=C - - Package - SOT323 package may be available upon special request 1 2007-07-24 BCR108... Maximum Ratings Parameter Symbol Value Collector-emitter voltage VCEO 50 Collector-base voltage VCBO 50 Input forward voltage Vi(fwd) 20 Input reverse voltage Vi(rev) 5 Collector current IC Total power dissipation- Ptot 100 200 BCR108F, TS ≤ 128°C 250 BCR108S, T S ≤ 115°C 250 BCR108W, TS ≤ 124°C 250 Tj Storage temperature Tstg Thermal Resistance Parameter Junction - soldering point1) Symbol RthJS 150 mA °C -65 ... 150 Value BCR108 ≤ 240 BCR108F ≤ 90 BCR108S ≤ 140 BCR108W ≤ 105 1For V mW BCR108, TS ≤ 102°C Junction temperature Unit Unit K/W calculation of RthJA please refer to Application Note Thermal Resistance 2 2007-07-24 BCR108... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collector-emitter breakdown voltage V(BR)CEO 50 V IC = 100 µA, IB = 0 Collector-base breakdown voltage V(BR)CBO 50 - - I CBO - - 100 nA I EBO - - 164 µA h FE 70 - - - - - 0.3 V Vi(off) 0.4 - 0.8 Vi(on) 0.5 - 1.1 Input resistor R1 1.5 2.2 2.9 Resistor ratio R1/R 2 0.042 0.047 fT - 170 - MHz Ccb - 2 - pF IC = 10 µA, IE = 0 Collector-base cutoff current VCB = 40 V, IE = 0 Emitter-base cutoff current VEB = 5 V, IC = 0 DC current gain1) IC = 5 mA, VCE = 5 V Collector-emitter saturation voltage1) VCEsat IC = 10 mA, IB = 0.5 mA Input off voltage IC = 100 µA, VCE = 5 V Input on voltage IC = 2 mA, VCE = 0.3 V kΩ 0.052 - AC Characteristics Transition frequency IC = 10 mA, VCE = 5 V, f = 1 MHz Collector-base capacitance VCB = 10 V, f = 1 MHz 1Pulse test: t < 300µs; D < 2% 3 2007-07-24 BCR108... DC current gain hFE = ƒ(IC) VCE = 5V (common emitter configuration) Collector-emitter saturation voltage TA = Parameter TA = Parameter 10 VCEsat = ƒ(IC), IC/IB = 20 3 0.5 V V CEsat h FE 0.4 10 2 0.35 0.3 -40 °C -25 °C 25 °C 85 °C 125 °C 0.25 10 -40 °C -25 °C 25 °C 85 °C 125 °C 1 0.2 0.15 0.1 0.05 10 0 -4 10 10 -3 10 -2 A 10 0 -3 10 -1 10 -2 A 10 IC IC Input on Voltage Vi(on) = ƒ(IC ) VCE = 0.3V (common emitter configuration) Input off voltage V i(off) = ƒ(IC) VCE = 5V (common emitter configuration) TA = Parameter TA = Parameter 1 Vi(on) V 10 1 V -40 °C -25 °C 25 °C 85 °C 125 °C Vi(off) 10 10 0 10 -1 -5 10 -1 -40 °C -25 °C 25 °C 85 °C 125 °C 10 0 10 -4 10 -3 10 -2 A 10 10 -1 -5 10 -1 IC 10 -4 10 -3 10 -2 A 10 -1 IC 4 2007-07-24 BCR108... Total power dissipation Ptot = ƒ(TS) Total power dissipation Ptot = ƒ(TS) BCR108 BCR108F 300 300 mW 250 250 225 225 200 200 P tot P tot mW 175 175 150 150 125 125 100 100 75 75 50 50 25 25 0 0 15 30 45 60 75 90 105 120 °C 0 0 150 15 30 45 60 75 TS 90 105 120 °C Total power dissipation Ptot = ƒ(TS) Total power dissipation Ptot = ƒ(TS) BCR108S BCR108W 300 300 mW mW 250 250 225 225 200 200 Ptot Ptot 150 TS 175 175 150 150 125 125 100 100 75 75 50 50 25 25 0 0 15 30 45 60 75 90 105 120 °C 0 0 150 TS 15 30 45 60 75 90 105 120 °C 150 TS 5 2007-07-24 BCR108... Permissible Pulse Load RthJS = ƒ(tp ) BCR108 Permissible Pulse Load Ptotmax/P totDC = ƒ(tp) BCR108 10 3 10 3 P totmax / P totDC K/W RthJS 10 2 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 10 1 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 tp Permissible Pulse Load BCR108F Ptotmax/P totDC = ƒ(tp) BCR108F 10 2 0 10 0 10 3 Ptotmax /PtotDC K/W RthJS 10 tp Permissible Puls Load RthJS = ƒ (tp) D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 1 10 0 10 -1 -6 10 s 10 -5 10 -4 10 -3 10 10 2 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s tp 6 2007-07-24 BCR108... Permissible Puls Load RthJS = ƒ (tp) Permissible Pulse Load BCR108S Ptotmax/P totDC = ƒ(tp) BCR108S 10 3 10 3 P totmax / P totDC K/W RthJS 10 2 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 10 1 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 tp s 10 0 10 0 tp Permissible Puls Load RthJS = ƒ (tp) Permissible Pulse Load BCR108W Ptotmax/P totDC = ƒ(tp) BCR108W 10 3 10 3 Ptotmax / PtotDC K/W RthJS 10 2 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 10 1 -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s tp 7 2007-07-24 Package SOT23 BCR108... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 8 2007-07-24 Package SOT323 BCR108... Package Outline 0.9 ±0.1 2 ±0.2 0.3 +0.1 -0.05 0.1 MAX. 3x 0.1 M 0.1 A 1 2 1.25 ±0.1 0.1 MIN. 2.1 ±0.1 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 0.8 1.6 0.6 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) BCR108W Type code Pin 1 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 9 2007-07-24 Package SOT363 BCR108... Package Outline 2 ±0.2 0.9 ±0.1 +0.1 6x 0.2 -0.05 0.1 0.1 MAX. M 0.1 Pin 1 marking 1 2 3 A 1.25 ±0.1 4 0.1 MIN. 5 2.1 ±0.1 6 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 1.6 0.9 0.7 0.3 0.65 0.65 Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Manufacturer 2005, June Date code (Year/Month) Pin 1 marking Laser marking BCR108S Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. 0.2 2.3 8 4 Pin 1 marking 1.1 2.15 10 2007-07-24 Package TSFP-3 BCR108... Package Outline 0.2 ±0.05 0.55 ±0.04 1 1.2 ±0.05 0.2 ±0.05 3 2 0.2 ±0.05 10˚ MAX. 0.8 ±0.05 1.2 ±0.05 0.15 ±0.05 0.4 ±0.05 0.4 ±0.05 Foot Print 1.05 0.45 0.4 0.4 0.4 Marking Layout (Example) Manufacturer BCR847BF Type code Pin 1 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 1.2 1.5 8 0.3 Pin 1 0.7 1.35 11 2007-07-24 BCR108... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 12 2007-07-24